Annotation of the article

Issue N9 2017 year

DOI: 10.17587/nmst.19.551-555

Approbation of 3D Printing Containers for Semiconductor Dice of Complex Shapes from Antistatic Material

Dashkov A.V., Laboratory Technician, e-mail: ohamawork@gmail.com, Institute of Ultra High Frequency Semiconductor Electronics of RAS, Moscow, 117105, Russian Federation, Shchavruk N.V., Senior Researcher, V. G. Mokerov Institute of Ultra High Frequency Semiconductor Electronics of Russian Academy of Sciences (IUHFSE RAS), Moscow, 117105, Russian Federation, Shcheglova T.A., Engineer-researcher, V. G. Mokerov Institute of Ultra High Frequency Semiconductor Electronics of Russian Academy of Science (IUHFSE RAS), Moscow, 117105, Russian Federation, Tarasov N.S., Junior Researcher, V. G. Mokerov Institute of Ultra High Frequency Semiconductor Electronics of Russian Academy of Sciences (IUHFSE RAS), Moscow, 117105, Russian Federation, Maltsev P.P., Chief Researcher, e-mail: p.p.maltsev@mail.ru, IUHFSE RAS, Khabibullin R.A., Head of the Lab., Leading Scientific Researcher, Institute of Ultra-High-Frequency Semiconductor Electronics of the Russian Academy of Sciences (IUHFSE RAS), Moscow, Moscow Institute of Physics and Technology (National University), Moscow

It is presented approbation of antistatic case fabricating method for storage and carrying irregular shape dies by 3D printing. Timeliness is determined of mismatch with external dimensions of dies and serial case cell, as well as purchasing of them can available of large consignment only.

Keywords: chip trays, 3D printing, 3D modeling, optoelectronics, QCL

pp. 551 - 555