NANO- AND MICROSYSTEMS TECHNOLOGY

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Word Microtechnologies Congress "MICRO.tec 2003"

Call for papers

October 13–15, 2003
International Congress Centre, Munich, Germany

Science and Technology meets Applications

October 13 – 15, 2003
International Congress Centre, Munich, Germany

Invitation to Participation

Microtechnologies are the base technologies for innovative engineering solutions and the integration of technical intelligence in future products. The miniaturisation of mechanical and electronic elements combined with their technical integration with embedded information processing to produce microsystems has the potential for a new generation of products in a wide spectrum of applications. Intensive research and development influences the strategies of development in nearly all branches of industry. The down-scaling from existing small products and components and up-scaling from the nano level is a key factor of future developments.

The aim of the 2^nd VDE World Microtechnologies Congress is to present results of R&D, systems and applications and to provide a discussion panel in research, engineering, development, application and manufacturing of micro- and nanosystems. The conference will help to exchange experiences in R&D&M, enable the discussion of innovative technical solutions and practical problems, spread information about these technologies in order to stimulate industrial applications and to develop industrial resources for successful engineering and manufacturing.

This congress will provide an unique forum for practice and engineering people to discuss the state of the art and future developments with experts and meet the international society in micro- and nanotechnologies. We invite international researchers and engineers who are involved in related research and industries to participate by both attending and presenting their results.

Stephanus Buttgenbach - Technical University of Braunschweig
Engelbert Westkamper - University of Stuttgart

Conference Venue

Munich (Munchen) is the capital of the federal state of Bavaria, home of finest museums, surrounded by castles that uniquely combine Italian charm and Greek classicism, and one of Germany’s most prosperous cities.

More details on Munich my be seen on www.muenchen.de

MICRO.tec 2003 Highlights

Conference and exhibition
Students and young engineers meet MICRO.tec 2003
Invent-a-chip: An innovative pupils competition
Trips and tours

Conference Schedule

Date
October 13 –15, 2003

Venue
International Congress Center, Munich, Germany

Language
The official language of the congress is English.

Keynote and Plenary Sessions
The Keynote and Plenary Sessions of the congress feature presentations and debates by some of the foremost figures in the microtechnology industry, science and political authority; leading the conference into its exploration of global technologies, engineering and applications.

Technical program
The congress will feature over 80 technical presentations in the field of microtechnology.

Tool demonstration
Tool demonstrations are planned to give companies the opportunity to present their latest developments in hard- and software. For more information on exhibiting please contact the organisers at the following address or e-mail at href=mailto:vde-conferences@vde.com>vde-conferences@vde.com and an exhibitors kit will be sent to you by reply.

VDE Conference Department
Stresemannallee 15
60596 Frankfurt am Main – Germany
Tel.: + 49 69 63 08 202/477
Fax: + 49 69 96 31 5213

Conference Topics

Authors are requested to submit papers on the following topics:

Micro- and Nanotechnologies

Micromanufacturing Technologies and Systems
Microfactories / Microproduction Systems
Assembly and Packaging
Laboratory and Factory Equipment
Modeling, Simulation and Test
Engineering and Design of Microsystems
Micro and Nano Interfaces

Microelectronics

Technologies
Application of Specific Electronics
Embedded System Technologies

Life Sciences

Environmental Sensing
Medical Diagnostic and Therapy Devices
Nanobio – Technology
Kryobio – Technology, Low Temperature MEMS
Microfluidic Systems and Microreactors

Information and Communications

Optical Technologies
Microwave Systems
Smart Antennas
Display Technologies
Smart Cards
Handhelds, Microphones, Speakers

Measuring and Control Systems

Microsensors
Microactuators
Signal Processing and Control
Measurement in the Micro- and Nanoscale
Human Machine Interaction

Smart Energy

Microsystems for Intelligent Generation and Distribution of Energy
Smart Power Supplies for Microsystems

Modularisation/Standardisation

MEMS
Tolerancing Systems
International Standardisation

Automotive Applications

Powertrain Control
Chassis Systems
Driver Assistance and Periphery Sensing
Comfort Systems
Safety Applications

Topics of the Conference and Evaluation Criteria

Authors are requested to supply papers for one or more of the areas of interest listed overleaf. When preparing the abstract please indicate which topic your contribution should belong to (e.g. 2(1)). In addition to the regular scientific papers, application oriented papers are strongly solicited. These papers should describe components, subassemblies, or even subsystems, which can be part of a system in development or already in production. The criteria used for the selection of a paper are applicability to support future developments and its usefulness to other members of the Microsystems community. Application oriented papers will be reviewed separately, employing different evaluation criteria than those applied to academic contributions. Applicants should indicate whether their paper is for an oral or poster presentation. Special attention will be focused on Student Papers.

Submission Instructions for Abstracts

Each abstract should clearly and concisely state the problem addressed, the methodology used, and the central conclusions. The title of the paper should clearly convey the essence of the work. Use the following compulsory guidelines for the preparation of the abstracts:

Title of paper.
Complete information regarding the (presenting) author, affiliation, address, phone, fax and e-mail.
Indicate corresponding authors (first author assumed unless otherwise noted).
Indicate preferred topic areas, using the conference topic list (e.g. 7(2)).
Limit to 2 pages including authors’ information, graphics and reference index.
All abstracts will be subject to international peer review and will be evaluated for technical content and merit, innovative contribution, clarity, and relevance to the conference theme.
When contributing to this conference authors declare to comply with the copyright regulations laid down on: www.vde-verlag.de > typing instructions for proceedings. Moreover, a selection of papers will be published in IEE publications. The congress organisers assume author’s agreement when contributing to the conference.
Indicate whether oral or poster presentation is preferred.

Abstracts must be submitted by March 31, 2003. They must be in PDF format and submitted only by e-mail to: VDE Conference Department, conference-papers@vde.com

Student Paper Award

A Best Student Paper Award will be issued at the conference. Applicants should indicate if their paper should be considered for this competition and include a proof of student membership (copy of student certification).

Notification of Authors

Authors will be notified of acceptance of their paper by May 5, 2003. Detailed instructions for the preparation of the final paper will be given with the notification.

Language

Papers must be written in English.

Conference Fee

Presenting authors may register at the reduced conference fee for University Members (approx. €260). Authors are kindly requested to register immediately after notification.

Paper Timeline

March 31, 2003: Abstracts due. Contributions received after this date will not be accepted.
May 5, 2003: Notification of selected papers.
June 15, 2003: Publication of Conference Program.
August 10, 2003: Final paper due (max. of 6 pages including graphics and reference index). Papers delivered beyond this deadline may not be reproduced in the conference proceedings.

Additional Information

For more information on the Program as well as the Special Events, Accompanying Persons Program, Booking of Accommodation and Transportation Information, please visit our web site regularly at www.microtec-conference.de to view the latest developments as they come out.

For any assistance please contact our hotline on:
+ 49 69 63 08 -202/ 477 or send an e-mail to: vde-conferences@vde.com

Organising Societies and Sponsoring Institutions

MICRO.tec 2003 is organised by:

GMM: VDE/VDI-Society Microlelectronics, Micro- and Precision Engineering
VDE: Association for Electrical, Electronic and Information Technologies together with VDE-Societies
ITG: Information Technology Society
DGBMT: German Association for Biomedical Engineering
GMA: VDI/VDE-Society for Measurement and Automatic Control
ETG: Energy Technology Society

Sponsoring Institutions
MICRO.tec 2003 gratefully acknowledges the contributions and support of the following sponsors:

EUREL: Convention of National Societies of Electrical Engineers of Europe
IEE: Institution of Electrical Engineers
VDI/VDE-IT: VDI/VDE Engineering Centre for Information Technology
ZVEI: German Electrical and Electronic Manufacturers Association
VDMA: German Machinery and Plant Manufacturers e.V.

Program Committee
S. Buttgenbach, Braunschweig, Germany (Co-Chair)
E. Westkamper, Stuttgart, Germany (Co-Chair)

L. Alting, Denmark
M. Bergh, Sweden
P. Bley, Germany
A. Bodensohn, Germany
A. D’Amico, Italy
N.F. de Rooij, Switzerland
M. Desmulliez, UK
W. Ehrfeld, Germany
J.C. Eloy, France
M. Gaitan, USA
H.H. Gatzen, Germany
M. Klein, Germany
F. Klocke, Germany
H. Kuck, Germany
A. Nathan, Canada
F. Robic, France
K. Sato, Japan
H.-R. Trankler, Germany
H. van Brussels, Belgium
R. Weigel, Germany
H. Weule, Germany
R. Zengerle, Germany

Steering Committee
J. Berger, Germany
J.-D. Buchs, Germany
S. Buttgenbach, Germany (Co-Chair)
Ms. N. Chapple, UK
K.J. Ebeling, Germany
G.R. Fuhr, Germany
J.W. Gardner, UK
G.H. Hertel, Germany
R. Rompel, Germany
Ch. Stoppok, Germany
R. Theobald, Germany
E. Westkamper, Germany (Co-Chair)
G. Wilkening, Germany
K. Zimmer, Germany

VDE, the Association for Electrical, Electronic & Information Technologies is one of the largest technical and scientific associations in Europe with more than 33.000 members. It is not just engineers who belong to the VDE but also scientists of various other disciplines, students and about 1,250 companies in the electrical, electronic and information technology industry, the electrical utilities, federal authorities and institutions.

VDE

VERBAND DER ELEKTROTECHNIK ELEKTRONIK INFORMATIONSTECHNIK e.V.

ASSOCIATION FOR ELECTRICAL, ELECTRONIC & INFORMATION TECHNOLOGIES

Stresemannallee 15 60596 Frankfurt am Main, Germany

Tel.: +49 69 63 08-202/477
Fax: +49 69 96 31 52 13
Internet: www.vde.com
e-mail: vde-conferences@vde.com

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