• 20th INTERNATIONAL SYMPOSIUM "NANOSTRUCTURES: PHYSICS AND TECHNOLOGY"
• Nanotech Europe 2009
• SMART SYSTEMS INTEGRATION 2009
• The 14th Canadian Semiconductor Technology Conference (CSTC-2009) and the 4th Nano & Giga Forum (NGC-2009 - Nano & Giga Challenges in Electronics, Photonics, and Renewable Energy).
• http://www.ioffe.ru/natoarw/2009/ 29 June –02 July, 2009
• Design, Test, Integration & Packaging of MEMS/MOEMS
• V МЕЖДУНАРОДНАЯ ВЫСТАВКА NTMEX 08
• 5th International Technology Transfer Days BIOMATERIAL 2009
• COMS - Commercialization of Micro and Nano Systems Conference, 31st August - 4th September 2008, Puerto Vallarta, Mexico
• ICCE - Integration and Commercialization of Micro and Nanosystems International, 3rd - 5th June 2008, Hong Kong, China
• The Fourth International Conference on "Science and Business": NanoBio and Related New and Perspective Biotechnologies Pushchino Biological Center of Russian Academy of Sciences Moscow Region, Russia, October 15 - 18, 2007.
• MicroNanoWorld
• SYMPOSIUM on Design, Test, Integration and Packaging of MEMS/MOEMS
• Micro-Nano Technologies for Aerospace Applications From Concepts to Systems.
• 20th Eurosensors Conference Anniversary
• Symposium and School on Nano
  and Giga Challenges in Electronics and Photonics:
  from Atoms to Materials to Devices
  to System Architecture
• MEMS & MST Conference
• I A R P
  International Advanced Robotics Programme
• 10th International Conference on the Commercialization of Micro and Nano Systems
  COMS 2005
• ICMNE 2005 QI-2005
  International Conference “Micro-& nanoelectronics-2005”
  and International Symposium “Quantum Informatics – 2005”
• Symposium on Design, Test, Integration and Packaging of MEMS / MOEMS
• International Congress of Nanotechnology 2004
• PEM-2004
  Ninth International Science Conference
  "Actual Problems of Solid-State Electronics and Microelectronics"
• Int'l Workshop on MEMS and NANOTECHNOLOGY INTEGRATION (MNI): APPLICATIONS
• NATO
  Advanced Research Workshop
  Science and Technology of Semiconductor-On-Insulator structures and devices operating in a harsh environment
• Symposium on Desigen, Test, Integration and Packaging of MEMS / MOEMS 2004
• European Micro and Nano systems 2004
• MANCEF - Micro and Nanotechnology Commercialization Education Foundation
• IEE Proceedings – Science, Measurement and Technology
• 10th Saint Petersburg international conference on integrated navigation systems
• 11th International Symposium «NANOSTRUCTURES: PHYSICS AND TECHNOLOGY»
• Word Microtechnologies Congress "MICRO.tec 2003"
• Nanotechnology Conference and Tradeshow "NanoTech 2003"
• International conference on microrobots, micromachines and microsystems
• Design, Test, Integration and Packaging of MEMS / MOEMS
• IV International scientific-technical conference "Electronics and information science - 2002"

Symposium on Desigen, Test, Integration and Packaging of MEMS / MOEMS 2004

12-14 May 2004 - Hôtel Eden au Lac - Montreux, Switzerland.
Sponsored by		In cooperation with
CNRS-INPG-UJF IEEE Computer Society	The Institute of Electrical and Electronics Engineers, Inc. IEEE Components, Packaging and Manufacturing Technology Society   Test Technology Technical Council	IEEE Circuits and Systems Society
Chair:Bernard COURTOIS,TIMA Labs, Grenoble, France Co-Chair:Karen MARKUS,Zeus Strategies, LLC, Durham, USA

Submission of abstracts 31 October 2003

Notification of acceptance 31 December 2003

Conferences
CAD, Design and Test	Microfabrication, Integration and Packaging
Chair: J. KORVINK, University of Freiburg, Germany Co-Chair: J.M. KARAM, MEMSCAP, Bernin, France Programme Committee I. Balk, the Ramzay Technologies Inc, Brighton, USA A. Kaiser, IEMN, Lille, France A. Wild, Motorola, München, Germany B. Vigna , STMicroelectronics, Cornadero, Italy B. Charlot, TIMA, Grenoble, France B. Romanovicz, Applied Comput. Res. Society, Cambridge, USA S. Blanton, Carnegie Mellon Univ., Pittsburgh, USA C. Cane, Univ. of Barcelona, Spain Y.C. Liang, National Univ. of Singapore P. Wu, National Chiao Tung Univ., Hsinchu City, Taiwan F. Maloberti, Texas A&M Univ., College Station, USA M. Ismail, Ohio State Univ., Columbus, USA D. Keating, Corning Intellisense, Wilmington, USA R. Laur, Univ. Bremen, Germany M.A. Maher, MemsCap Inc., San Jose USA F. Pressecq, CNES, Toulouse, France M. Rencz, Zeus Strategies, LLC, Durham, USA R. Rudd, Lawrence Livermore National Lab., Livermore, USA J. Samitier, Univ. of Barcelona, Spain M. Santiago, Univ. Barcelona, Spain O. Sigmund, TU of Denmark, Lyngby, Denmark T. Bourouina, ESIEE, Noisy le Grand, France T. Mukherjee, Carnegie Mellon Univ., Pittsburgh, USA T. Veijola, Helsinki Univ. of Technology, Finland G. Wachutka, TU München, Germany Z. Cui, RAL, Didcot, UK This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks. The topics for this Conference include (preliminary): Technology CAD in general Modeling and simulation of fabrication processes Devices and components (sensors, actuators, ...) MEMS/MOEMS libraries and IP Signal processing Integrated CAD tools Numerical simulation Yield estimation Failure mechanisms Fault modeling Fault simulation and test pattern generation Mechanical simulation Thermal evaluation Interoperability of CAD/CAE tools Multiphysics simulation Structured design methodologies Languages for interchange data among designs and tools Model order reduction	Chair: A. IONESCU, EPFL Lausanne, Switzerland Co-Chair: M. ESASHI, Tohoku University, Japan Programme Committee V. Bright, Univ. of Colorado, Boulder, USA H. Fujita, Univ. of Tokyo, Japan R. Maeda, MITI, Tsukuba, Japan P. Viktorovitch, LEOM, Ecully, France D. Allen, Cranfield Univ., Bedford, UK F. Tay, National Univ. of Singapore D. Tolfree, DRAL, Warrington, UK A. Tay, National Univ. of Singapore G.S. Kuo, National Chengchi Univ., Taipei, Taiwan A.Q. Liu, Nayang Technological Univ., Singapore M. de Labachelerie, LPMO, Besançon, France C. Khan Malek, LSAI, Paris, France J. Jakubczak, Sandia Nat. Labs, Albuquerque, USA D. Seeger, IBM, Watson Research Center, Yorktown Heights, USA V. Kempe, Sensor Dynamics AG, Austria M. Heckele, KFK/IMT, Karlsruhe, Germany J. Dual, ETH Zurich, Switzerland J. Walker, USA H. Yang, National Chung Hsing Univ., Taiwan N. Meyendorf, Univ. of Dayton, USA B. Weiss, Univ. of Vienna, Austria S. Basrour, TIMA, Grenoble, France K. Sato, Nagoya Univ., Nagoya, Japan B. Michel, IZM, Berlin, Germany E. Jung, IZM, Berlin, Germany D. Collard, IEMN, Villeneuve dХAscq, France K. Bergman, Columbia Univ., New York, USA P. French, TU Delft, The Netherlands P. Nicole, Thales Group, France H. Hartnagel, TU Darmstadt, Germany H. Wicht, Wicht Technologie Consulting, München, Germany This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks. The topics for this Conference include (preliminary): Integrated processes (micromachining, micromolding, ...) Process integration between MEMS and electronics Microlithography issues unique to MEMS/MOEMS Manufacturing Materials Assembly technologies Packaging for harsh environments MOEMS packaging RF and microwave packaging Test structures Devices & components (sensors, actuators, ...) Dimensional measurements Physical measurements Failure analysis Reliability Characterization Process monitoring Non destructive evaluation

Plenary invited talks Plenary invited talks given by prominent speakers will include:
K. MURATA, National Institute of Advanced Industrial Science and Technology Nanotechnology Research Institute, Ibaraki, Japan	Super-fine inkjet printing -toward the minimal manufactuaring system- A super-fine inkjet system which allows arrangements of dots with a minimum size of less than one micron has been developed. We will show the possibility toward the minimal manufacturing system.
Gary K. FEDDER, Carnegie Mellon University, USA	RF MEMSoC The demand for low-power embedded wireless capability is driving a trend to make more sophisticated and better performing RF systems on chip. Advances in CMOS and BiCMOS micromachining has led to recent work on MEMS-enabled RF circuits that exploit on-chip passives with superior quality factor and tuning capabilities.
F. UDREA, Cambridge University, UK	SOI gas sensing microsystems The development of solid state gas sensors and their gradual transition to smart CMOS technology will be reviewed, follow by a detailed discussion of advantages/disadvantages of using SOI micromachning technology compared to standard bulk technology. New concepts in SOI microsystems such as use of CMOS compatible layers for micro-hotplates will also be described. The presentation will end with a discussion on the use of smart gas sensors in high volume wireless applications.

Contacts
Bernard COURTOIS TIMA Tel.: +33 476 574 615 Fax: +33 476 473 814	Karen MARKUS Zeus Strategies
Exhibition An exhibition will be organized in the framework of the Symposium. CAD software, products, equipments, instruments, foundries offerings, ...etc, may be exhibited. Exhibitors who will register early enough will be given the opportunity to give a product presentation during the vendor session that will be placed in the Symposium programme. If you plan to exhibit, please contact the Symposium Chair.
Specific Events Sponsoring If you wish to sponsor an event like a reception, a lunch, or any specific event during the Symposium, please contact the Symposium Chair.
Advertising in the programme booklet The programme booklet will be widely distributed to announce the Symposium. If you wish to advertise in the programme booklet, please contact the Symposium Chair.
Location The Symposium will be held at the Hôtel Eden au Lac in Montreux, Switzerland. On the shores of lake Geneva, the Hôtel Eden au Lac overlooks the lake and the majestic Alps to the south. The hotel is less than an hour away from Geneva airport. The distance from Geneva international airport is 90km. Time & cost by taxi: approx. 45 minutes & approx. SFr 300. Time & cost by train: approx. 70 minutes & approx. - second class SFr 31, first class SFr 52. Hôtel EDEN AU LAC 11, rue du Théâtre CH - 1820 Montreux Switzerland Tel.: +41 21 966 0 800 Fax: +41 21 966 0 900
Paper Review To ensure a high-quality Symposium, all abstracts will be reviewed by the Programme Committee members under the leadership of the Conference Chairs, and the Proceedings papers will be reviewed by the Conference Chairs for technical merit and content. Oral or Poster Presentation Submitted papers may be selected for oral or poster presentation. All oral and poster presentations will be included in the Symposium Proceedings. Submission of Abstracts Your abstract must include the following: ABSTRACT TITLE AUTHOR LISTING (principal author first) First (given) name, Last (family) name, and affiliations, mailing address, telephone, fax and e-mail address. PRESENTATION Indicate your preference for "Oral Presentation" or "Poster Presentation". Placement is subject to chair's discretion. ABSTRACT TEXT Not less than 250 words, preferably 1500 words. KEY WORDS List a maximum of five key words. BRIEF BIOGRAPHY (of principal author) Approximately 50 words. Submission will be electronically only. Detailed instructions will be posted in due time on the Symposium web site. Questions may be directed in the meantime by email (dtip@imag.fr).
Conditions of Acceptance Authors are expected to secure registration fees and travel and accommodation funding, through their sponsoring organizations, before submitting abstracts. Abstracts should contain enough detail to clearly convey the approach and the results of the research. Government and company clearance to present and publish should be final at the time of submittal. Commercial papers with no research, presenting products, cannot be submitted to the Symposium. Such papers can be presented in the framework of the exhibition (see corresponding section).
Special Issues of Journals and Magazines It is a tradition that Special Issues of Journals and Magazines are published after the Symposium. These Special Issues collect revised versions of papers presented during the Symposium. DTIP 2004 Special Issues will be organized in the Journal of Microsystem Technologies and in the Journal of Analog Integrated Circuits and Signal Processing.
Proceedings Proceedings of this symposium will be available at the meeting as part of the registration fee.

Laboratoire TIMA: http://tima.imag.fr/