SYMPOSIUM on Design, Test, Integration and Packaging of MEMS/MOEMS

25-27 April 2007
Stresa, Lago Maggiore, Italy

Chair: B. COURTOIS, TIMA Labs, Grenoble, France
Co-Chair: J-M. KARAM, MEMSCAP, Bernin, France

CONFERENCES:

CAD, DESIGN AND TEST
Chair: K. CHAKRABARTY, Duke Univ., Durham, USA
Co-Chair: R. LAUR, Univ. of Bremen, Germany

MICROFABRICATION, INTEGRATION AND PACKAGING
Chair: E. JUNG, IZM, Berlin, Germany
Co-Chair: V. KEMPE, SensorDynamics AG, Austria

INVITATION TO PARTICIPATE

This Symposium will be a follow-up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu-La Napoule, in 2004 and 2005 in Montreux, Switzerland and in 2006 in Stresa, Italy. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. We look forward to welcoming you to Stresa and encourage you to participate by submitting an abstract for one of the two Conferences.

B. COURTOIS
J-M. KARAM

CAD, Design and Test Conference
Chair: K. CHAKRABARTY, Duke Univ., Durham, USA
Co-Chair: R. LAUR, Univ. of Bremen, Germany Programme Committee: TBD
This Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.
The topics for this Conference include (preliminary):

Technology CAD in general
Modeling and simulation of fabrication processes
Devices and components (sensors, actuators, …)
MEMS/MOEMS libraries and IP
Signal processing
Integrated CAD tools
Numerical simulation
Yield estimation
Failure mechanisms
Fault modeling
Fault simulation and test pattern generation
Mechanical simulation
Thermal evaluation
Interoperability of CAD/CAE tools
Multiphysics simulation
Structured design methodologies
Languages for interchange data among designs and tools
Model order reduction

PLENARY INVITED TALKS:
TBD
EXHIBITION
An exhibition will be organized in the framework of the Symposium. CAD software, products, equipments, instruments, foundries offerings, etc. may be exhibited. Exhibitors who will register early enough will be given the opportunity to give a product presentation during the vendor session that will be placed in the Symposium programme. If you plan to exhibit, please contact the Symposium Chair.
SPECIFIC EVENTS SPONSORING
If you wish to sponsor an event like a reception, a lunch, or any specific event during the Symposium, please contact the Symposium Chair.
ADVERTISING IN THE PROGRAMME BOOKLET
The programme booklet will be widely distributed to announce the Symposium. If you wish to advertise in the programme booklet, please contact the Symposium Chair.
DATES
Submission of abstracts: 10 November 2006
Notification of acceptance: 05 January 2007
VENUE:
The Symposium will take place in Stresa in Italy. This international tourist resort situated in a central but also panoramic and pictoresque position along the lakeside roadway, stands just in front of the Borromee isles. Since the second half of nineteenth century up to the first decades of the twentieth, when the first English touritsts arrived, Stresa, whose hotels and villas built in Liberty style make it unique, assumed its peculiar, elegant look. http://www.stresa.net/
PROCEEDINGS
The Proceedings of the Symposium will be available at the meeting.
SPECIAL ISSUES OF JOURNALS AND MAGAZINES
It is a tradition that Special Issues of Journals and Magazines are published after the Symposium. These Special Issues collect revised versions of papers presented during the Symposium. DTIP 2007 Special Issues will be organized in the Journal of Microsystem Technologies and in the Journal of Analog Integrated Circuits and Signal Processing. Microfabrication, Integration and Packaging Conference
Chair: E. JUNG, IZM, Berlin, Germany
Co-Chair: V. KEMPE, SensorDynamics AG, Austria Programme Committee: TBD

This Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks. The topics for this Conference include (preliminary):

Integrated processes (micromachining, micromolding, …)
Process integration between MEMS and electronics
Microlithography issues unique to MEMS/MOEMS
Manufacturing
Materials
Assembly technologies
Packaging for harsh environments
MOEMS packaging
RF and microwave packaging
Test structures
Devices and components (sensors, actuators, …)
Dimensional measurements
Physical measurements
Failure analysis
Reliability
Characterization
Process monitoring
Non destructive evaluation

Special Issues will be organized in the Journal of Microsystem Technologies and in the Journal of Analog Integrated Circuits and Signal Processing.
CONTACTS
Bernard COURTOIS
TIMA Labs
Tel.: +33 4 76 57 46 15
Fax: +33 4 76 47 38 14
Email: Bernard.Courtois@imag.fr
Jean-Michel KARAM
MEMSCAP
Tel.: +33 4 76 92 85 00
Fax: +33 4 76 92 85 10
Email:Jean-Michel.Karam@memscap.com
PAPER REVIEW
To ensure a high-quality Symposium, all abstracts will be reviewed by the Programme Committee members under the leadership of the Conference Chairs, and the Proceedings papers will be reviewed by the Conference Chairs for technical merit and content.
ORAL OR POSTER PRESENTATION
Submitted papers may be selected for oral or poster presentation. All oral and poster presentations will be included in the Symposium Proceedings.
SUBMISSION OF ABSTRACTS
Submission will be electronically only at: http://tima.imag.fr/Conferences/dtip Your abstract must include preferably 1500 words. Detailed instructions are posted on the Symposium web site. Questions may be directed in the meantime by e-mail (dtip@imag.fr).
CONDITIONS OF ACCEPTANCE
Authors are expected to secure registration fees and travel and accommodation funding, through their sponsoring organizations, before submitting abstracts. Abstracts should contain enough detail to clearly convey the approach and the results of the research. Government and company clearance to present and publish should be final at the time of submittal.
Commercial papers with no research, presenting products, cannot be submitted to the Symposium. Such papers can be presented in the framework of the exhibition (see corresponding section).

Web site: http://tima.imag.fr/Conferences/dtip

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